The Esec 8003 Dicing Saw (wafersaw) is a precision machine used to cut semiconductor wafers into individual chips or dice. Wafers are held to the chuck table by means of vacuum and the chuck can accommodate circular and rectangular wafers in a range from 1″ to 6″. The maximum table stroke (left-right movement of the chuck table) is 240 mm. The index axis range is 240 mm with an index step sizes from 50 µm to 99,999 µm. The cutting feed speed is variable from 0.5 to 239 mm/sec.

The dicing wheel is mounted on a high frequency air-bearing spindle with a variable rotation speed of 15,000 rpm to 45,000 rpm. The range of depth left uncut is variable, and ranges from 10 µm to 5 mm in steps of 1 µm increments. (Do not use a Z-index of less than 0.07 mm without consulting a superuser.) Following each cut, the wafersaw uses stored parameters to automatically index the wafer along the Y-axis. The maximum spindle stroke (forward-backward movement of spindle) is 240 mm and the variable spindle index ranges from 50 µm to 99,999 µm in 1 µm increments. Up to three separate index step sizes may be specified for triangular or hexagonal die.

Cutting Modes
Mode 1: Up and down cutting without lifting the blade during the index step.
Mode 2: Down cuts only are made with the blade lifted during the index step. (Dice or scribe mode.)
Mode 3: Down cutting with up to three progressive levels in the same track. The level and feed rate are individually programmable.
Mode 4: Up and down cutting at different levels in the same track. Level and feed rate
individually programmable.
Mode 5: Up and down cutting with lifting the blade during the index step. (Dice mode)
Mode 6: Measurement Mode. To be called up as a subroutine at anytime for definition of index steps, width of cut etc. Move the image on the monitor to the desired 0 position and press AUTO MODE , 6, ENTER. Distance is displayed on the message line. Unit 2.5 microns/step.